RF360 - A Qualcomm & TDK Joint Venture


ECOSS rf360

RF360 Holdings

RF360 Holdings is a Qualcomm and TDK Joint Venture driving innovation in Radio Frequency Front End (RFFE). With over 4,000 employees worldwide, RF360 Holdings develops and manufactures innovative RFFE filtering solutions for mobile devices and fast growing business segments, such as IoT, drones, robotics, automotive applications and more.


RF360 Holdings offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe.

About Qualcomm Incorporated

Qualcomm Incorporated (NASDAQ:QCOM) is bringing the future forward faster with next generation mobile technologies that accelerate innovation across connectivity, computing, and the Internet of Things. Qualcomm began revolutionizing the future of mobile in 1985, and three decades later Qualcomm, working with customers across industries – from automotive to health care, from smart cities to robotics, continues to advance product development, access new markets and transform experiences for people around the world. With a continued focus on investing and innovating in next-generation technologies, Qualcomm continues to accelerate innovation and unlock new possibilities in a time where everything is connected.

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's portfolio includes electronic components, modules and systems* marketed under the product brands TDK and EPCOS, power supplies, magnetic application products as well as energy devices, flash memory application devices, and others.



RF360 - SAW Components Lineup